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Prototype, methodology, f. module, software

Support for TE0820 modules with Vitis AI 3.0 DPU

Kadlec Jiří, Pohl Zdeněk, Kohout Lukáš

: ( 2024)

: 9A23008, GA MŠk

: artificial intelligence, object detection, embedded systems, edge computing, Vitis AI 3.0, AMD-Xilinx, Zynq UltraScale+

: https://zs.utia.cas.cz/index.php?ids=results&id=5_TE0820_AI_3_0

(eng): Tutorial how to design custom HW platform with AMD DPU for Vitis 2022.2 AI 3.0 inference in configurations B1024 or B4096 for Trenz Electronic modules TE0820 on TE0701-06 carrier board.

: 20206

07.01.2019 - 08:39